Optical semiconductor package with compressible adjustment means

ABSTRACT

An optical semiconductor package includes a support with a passage to receive a ring holding a lens situated facing an optical sensor. The support has, in the passage, at least one local release recess and the ring is equipped peripherally with a locally projecting, elastically deformable element. The local release recess and the elastically deformable element are such that, when the ring occupies an angular mounting position, the locally projecting elastically deformable element is engaged in the local recess of the support and, when the ring is pivoted from the aforementioned angular mounting position, the locally projecting elastically deformable element is moved out of the recess of the support and is compressed against the wall of the passage in order to secure the ring relative to the support.

PRIORITY CLAIM

This application claims priority from French Application for Patent No.04 04133 filed Apr. 20, 2004, the disclosure of which is herebyincorporated by reference.

BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

The present invention relates to the field of optical semiconductorpackages.

2. Description of Related Art

Optical semiconductor packages are known which include a plate, on thefront of which are fixed an integrated circuit chip electrically linkedto this plate and chip encapsulation means, supporting an objective lenssituated facing the integrated optical sensor provided on the front ofthis chip.

Currently, these encapsulation means comprise a ring holding the lensand threaded externally, and a support with an internally threadedpassage. The ring is coupled to the support by threaded coupling and thelens is adjusted relative to the optical sensor of the chip by thenumber of screw turns. When the required adjustment position isachieved, the ring must then be fixed on the support. This is doneroutinely by an additional bonding operation.

A need accordingly exists in the art to simplify the above coupling,adjustment and fixing operations.

SUMMARY OF THE INVENTION

An optical semiconductor package in accordance with an embodiment of thepresent invention comprises a support with a passage to receive a ringholding a lens situated facing an optical sensor. The support has, insaid passage, at least one local release recess and the ring is equippedperipherally with a locally projecting, elastically deformable means.The local release recess and elastically deformable means are configuredsuch that, when the ring occupies an angular mounting position, thelocally projecting means is engaged in the local recess of the supportand, when the ring is pivoted from the aforementioned angular mountingposition, the locally projecting means is moved out of said recess ofthe support and is compressed against the wall of said passage in orderto secure the ring relative to the support.

According to a variant of the invention, the ring has at least oneperipheral groove and at least one stud projecting relative to thebottom of this groove, said elastically deformable means comprising anelastically deformable ring engaged in the peripheral groove and passingover said stud to be locally projecting.

According to a variant of the invention, said ring is in contact withthe wall of said passage of said support.

According to another variant of the invention, the ring has at least oneprojecting land forming said elastically deformable means.

According to a variant of the invention, said local release recess ispreferably formed by an axial groove opening out from at least one ofits ends.

According to a variant of the invention, the wall of said passagepreferably has at least one secondary local recess offset angularlyrelative to said local release recess, said locally projecting meansbeing engaged in said secondary local recess when the ring is in aholding angular position.

According to a variant of the invention, said secondary local recess ispreferably formed by an axial groove opening out from at least one ofits ends.

According to a preferred variant of the invention, the wall of saidpassage of the support has at least three peripherally spaced localrelease recesses and said elastically deformable means has three locallyprojecting corresponding parts.

In accordance with an embodiment of the invention, an opticalsemiconductor package comprises a first support mounted to asemiconductor supporting base member, an inner surface of the firstsupport having at least one axially extending first groove of a firstdepth and at least one axially extending second groove of a second depthwherein the first depth is greater than the second depth. A secondsupport is sized and shaped to be received within the first support. Atleast one elastically deformable projection extends from an outersurface of the second support sized to freely fit within the first depthof the first groove and compressibly fit within the second depth of thesecond groove.

In accordance with an embodiment of the invention, an opticalsemiconductor package comprises a first support mounted to asemiconductor supporting base member, an inner cylindrical surface ofthe first support having at least one axially extending first groove ofa first depth and a second support sized and shaped to be receivedwithin the first support. At least one elastically deformable projectionextends from an outer cylindrical surface of the second support sized tofreely fit within the first depth of the first groove and compressiblyfit against the inner surface of the first support when the secondsupport is rotated within the first support.

In accordance with another embodiment of the invention, an opticalsemiconductor package comprises a base member with an opticalsemiconductor chip mounted to the base member. A first support ismounted to the base member surrounding the optical semiconductor chip,an inner surface of the first support having at least one axiallyextending first groove. A second support is sized and shaped to bereceived within, and to be axially moved along, and to be rotatablymoved with respect to, an interior of the first support. At least oneelastically deformable projection extends from an outer surface of thesecond support sized to freely fit within the first depth of the firstgroove and compressibly fit against the inner surface of the firstsupport following rotation of the second support to fix an axialposition of the second support within the interior of the first support.A lens is fixedly mounted within an interior of the second support inaxial alignment with the optical semiconductor chip, a distance betweenthe lens and the optical semiconductor chip set by the axial positionfixation of the second support within the interior of the first support.

BRIEF DESCRIPTION OF THE DRAWINGS

Advantages and features of the invention will become apparent uponexamining the detailed description of the methods and embodiments of theinvention, which are in no way limiting, and the appended drawings inwhich:

FIG. 1 represents a longitudinal cross section of an opticalsemiconductor package according to the present invention;

FIG. 2 represents a transverse cross section of the opticalsemiconductor package of FIG. 1, in a release position;

FIG. 3 represents a transverse cross section of the opticalsemiconductor package of FIG. 1, in an adjustment and holding position;

FIG. 4 represents a transverse cross section of a variant of theaforementioned optical semiconductor package, in an engaged position;and

FIG. 5 represents a transverse cross section of the opticalsemiconductor package of FIG. 4, in an adjustment and holding position.

DETAILED DESCRIPTION OF THE DRAWINGS

Referring to FIGS. 1 to 3, it can be seen that the representation is ofan optical semiconductor package 1 which comprises an electricalconnection plate 2 on the front of which is bonded the back of anintegrated circuit chip 3, the front of which has an optical sensor 4.Electrical connection terminals provided on the front of the chip 3 arelinked to terminals on the front of the plate 2 by electrical lead wires5.

On the front of the plate 2 is fixed an annular support 6 whichsurrounds the chip 3 and the wires 5 at a distance, this support 6having a cylindrical passage 6 a to receive a cylindrical ring 7 holdingin its passage an optical objective lens 8, situated facing the opticalsensor 4 of the chip 3.

The wall of the receiving cylindrical passage 6 a has local releaserecesses formed by three axial release grooves 9 peripherally spaced at120° intervals, as well as secondary local recesses formed by threesecondary axial grooves 10 peripherally spaced at 120° intervals andoffset angularly relative to the main axial grooves 9, for example by30°, the axial release grooves 9 and the secondary axial grooves 10opening out at the front end of the passage 6.

In section, the axial release grooves 9 and the secondary axial grooves10 have concave rounded bottoms and convex rounded edges. The depth ofthe axial release grooves 9 is substantially greater than the depth ofthe secondary axial grooves 10.

The cylindrical ring 7 has a peripheral groove 11 at the bottom of whichare provided three projecting studs 12 at 120° intervals that do notreach the edges of this groove 11.

In the peripheral groove 11 of the ring 7 there is an elasticallydeformable ring 13 which passes over the studs 12 to form, at threepoints, locally projecting parts 14 relative to the peripheral face ofthe ring 7.

The ring 7 can be coupled in the support 6 by the following method.

For example, using a specially designed tool, the ring 7 is placedaxially facing the passage 6 a of the support 6 by placing the locallyprojecting parts 14 of the elastically deformable ring 13 in line withthe axial release grooves 9.

As FIG. 2 shows, the ring 7 is engaged axially in the passage 6 a of thesupport 6 as far as an axial adjustment position of the lens 8 relativeto the optical sensor 4 of the chip 3.

The peripheral groove 11 of the ring 7, its studs 12, the ring 13 andthe axial release grooves 9 of the support 6 are dimensioned to ensurethat this engaging movement is achieved preferably without friction.

When said axial adjustment position is reached, the ring 7 is pivoted orturned relative to the support 6. This done, the locally projectingparts 14 of the ring 13 are moved out of the axial release grooves 9 ofthe support 6 and are compressed against the wall of the passage 6 a ofthis support. The internal diameter of the passage 6 a of the support 6,the outer diameter of the ring 7 and the thickness of the locallyprojecting parts 14 of the ring 13 are adapted accordingly.

As FIG. 3 shows, when the locally projecting parts 14 of the ring 13 arelined up with the secondary grooves 10, the rotation of the ring 7 isstopped, these parts 14 expanding slightly into these secondary grooves10.

Then, the ring 7 which is then held in its axial adjustment position bythe elastic compression effect of the locally projecting parts 14 of thering 13 is released.

The elastic ring 13 can also be in contact with the wall of the passage6 a of the support 6 to form a protective seal.

Referring to FIGS. 4 and 5, it can be seen that a variant of the package1 is represented, in which the locking means of the ring 7 is, thistime, formed by three projecting lands 15 extending longitudinally overat least a part of the length of the outer wall of the ring 7 and at120° intervals. In the example shown, the lands 15 are integral to thering 7. As a variant, they could be added on.

The lands 15 have a section which reduces from their root to their tipand they are angled. The material chosen to produce the ring 7 is suchthat the lands 15 are elastically deformable.

The coupling of the ring 7 equipped with the lands 15 with the support 6can be achieved as described in the preceding example, the thickness ofthe elastically deformable lands 15 being adapted to the compressioneffect mentioned above. Furthermore, the lands 15 are preferably angledin the direction opposite to the direction of rotation of the ring 7 oncoupling.

Thus, as FIG. 4 shows, the ring 7 is engaged axially in the passage 6 aof the support 6 by engaging the projecting lands 15 axially in theaxial release grooves 9 of this support 6, as far as an axial adjustmentposition of the lens 8 relative to the optical sensor 4 of the chip 3,the lands 13 and the axial release grooves 9 of the support 6 beingdimensioned such that this engagement movement is preferably achievedwithout friction.

When said axial adjustment position is reached, the ring 7 is pivoted orturned relative to the support 6. This done, the lands 15 of the ring 7are moved out of the axial release grooves 9 of the support 6 and arecompressed against the wall of the passage 6 a of this support. Theinternal diameter of the passage 6 a of the support 6, the externaldiameter of the ring 7 and the form and the thickness of the projectinglands 15 of this ring 7 are adapted accordingly.

As FIG. 5 shows, when the lands 15 are lined up with the secondarygrooves 10, the rotation of the ring 7 is stopped, these parts 14expanding slightly into these secondary grooves 10.

Then, the ring 7 which is then held in its axial adjustment position bythe elastic compression effect of the lands 15 of the ring 7 isreleased.

The present invention is not limited to the example described above.Many variants are possible without departing from the context defined bythe appended claims.

1. An optical semiconductor package comprising: a support with a passageto receive a ring holding a lens situated facing an optical sensor,wherein said support has, in said passage, at least one local releaserecess and wherein the ring is equipped peripherally with a locallyprojecting, elastically deformable means, said local release recess andsaid elastically deformable means being such that, when the ringoccupies an angular mounting position, the locally projecting means isengaged in the local recess of the support and, when the ring is pivotedfrom the aforementioned angular mounting position, the locallyprojecting means is moved out of said recess of the support and iscompressed against the wall of said passage in order to secure the ringrelative to the support.
 2. The package according to claim 1, whereinthe ring has at least one peripheral groove and at least one studprojecting relative to the bottom of this groove, said elasticallydeformable means comprising an elastically deformable ring engaged insaid peripheral groove and passing over said stud to be locallyprojecting.
 3. The package according to claim 2, wherein said ring is incontact with the wall of said passage of said support.
 4. The packageaccording to claim 1, wherein the ring has at least one projecting landforming said elastically deformable means.
 5. The package according toclaim 1, wherein said local release recess is formed by an axial grooveopening out from at least one end of the local release recess.
 6. Thepackage according to claim 1, wherein the wall of said passage has atleast one secondary local recess offset angularly relative to said localrelease recess, said locally projecting means being engaged in saidsecondary local recess when the ring is in a holding angular position.7. The package according to claim 6, wherein said secondary local recessis formed by an axial groove opening out from at least one end of thesecondary local recess.
 8. The package according to claim 1, wherein thewall of said passage of the support has at least three peripherallyspaced local release recesses and wherein said elastically deformablemeans has three locally projecting corresponding parts.
 9. An opticalsemiconductor package, comprising: a first support mounted to asemiconductor supporting base member, an inner surface of the firstsupport having at least one axially extending first groove of a firstdepth and at least one axially extending second groove of a second depthwherein the first depth is greater than the second depth; a secondsupport sized and shaped to be received within the first support; and atleast one elastically deformable projection extending from an outersurface of the second support sized to freely fit within the first depthof the first groove and compressibly fit within the second depth of thesecond groove.
 10. The package of claim 9 wherein the elasticallydeformable projection comprises: a radially projecting stud member; andan elastically deformable ring peripherally surrounding the outersurface of the second support and overlying the radially projecting studmember.
 11. The package of claim 10 wherein the second support includesa peripheral groove formed in the outer surface of the second supportfor retaining the elastically deformable ring.
 12. The package of claim9 wherein the elastically deformable projection comprises a projectingland having a cross section that tapers from a root portion to a tipportion.
 13. The package of claim 12 wherein the projecting land anglesnon-perpendicularly away from the outer surface of the second supportfrom the root to the tip.
 14. The package of claim 9 wherein an innersurface of the second support supports fixed mounting of a lens in axialalignment with the supported semiconductor on the base member.
 15. Anoptical semiconductor package, comprising: a first support mounted to asemiconductor supporting base member, an inner cylindrical surface ofthe first support having at least one axially extending first groove ofa first depth; a second support sized and shaped to be received withinthe first support; and at least one elastically deformable projectionextending from an outer cylindrical surface of the second support sizedto freely fit within the first depth of the first groove andcompressibly fit against the inner surface of the first support when thesecond support is rotated within the first support.
 16. The package ofclaim 15 wherein the inner surface of the first support further includesat least one axially extending second groove of a second depth whereinthe first depth is greater than the second depth, and wherein theelastically deformable projection extending from an outer surface of thesecond support is sized to compressibly fit within the second depth ofthe second groove when the second support is rotated within the firstsupport.
 17. The package of claim 16 wherein the first support includesa plurality of first and second grooves, and the second support includesa corresponding plurality of elastically deformable projections.
 18. Thepackage of claim 15 wherein the first support includes a plurality offirst grooves, and the second support includes a corresponding pluralityof elastically deformable projections.
 19. The package of claim 15wherein the elastically deformable projection comprises: a radiallyprojecting stud member; and an elastically deformable ring peripherallysurrounding the outer surface of the second support and overlying theradially projecting stud member.
 20. The package of claim 19 wherein thesecond support includes a peripheral groove formed in the outer surfaceof the second support for retaining the elastically deformable ring. 21.The package of claim 15 wherein the elastically deformable projectioncomprises a projecting land having a cross section that tapers from aroot portion to a tip portion.
 22. The package of claim 21 wherein theprojecting land angles non-perpendicularly away from the outer surfaceof the second support.
 23. The package of claim 15 wherein an innersurface of the second support supports fixed mounting of a lens in axialalignment with the supported semiconductor on the base member.
 24. Anoptical semiconductor package, comprising: a base member; an opticalsemiconductor chip mounted to the base member; a first support mountedto the base member surrounding the optical semiconductor chip, an innersurface of the first support having at least one axially extending firstgroove; a second support sized and shaped to be received within, and tobe axially moved along, and to be rotatably moved with respect to, aninterior of the first support; at least one elastically deformableprojection extending from an outer surface of the second support sizedto freely fit within the first depth of the first groove andcompressibly fit against the inner surface of the first supportfollowing rotation of the second support to fix an axial position of thesecond support within the interior of the first support; and a lensfixedly mounted within an interior of the second support in axialalignment with the optical semiconductor chip, a distance between thelens and the optical semiconductor chip set by the axial positionfixation of the second support within the interior of the first support.